企业新闻
"teli TIME" 序列号 Vol.108
- 该链接内容为英语
August, 2023 [ Vol.108 ] |
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Dear Sirs and Madams, Stay tuned ! Announcing the latest technology. We are hoping to see you at the show !! |
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Case Study |
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Wafer inspection with CoaXPress 67M camera | ||
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Compare images taken with the 67.11 megapixel camera "EX670AMG-X" (8,192 x 8,192 pixels) and 4.19 megapixel camera (2,048 x 2,048 pixels) while keeping the same resolution. This comparison shows that the 67MP camera is capable of shooting more chips at once. |
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Related Product Information |
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CoaXPress 2.0 Camera "EX670AMCG-X" | ||
[ Key features ] - 67MP / 64.5fps CMOS Color - TELI original IP core - Global electronic shutter - CoaXPress 2.0 interface |
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Updated information/Software Information |
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Software development kit "TeliCamSDK for Linux" has also been updated ! | ||
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Features of software development kit of "TeliCamSDK for Linux" for our machine vision camera are renewed ! The new version supports our USB3, GigE and CoaXPress cameras. |
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Thanks for reading, and we are looking forward to seeing you soon ! | ||
This e-mail newsletter is delivered to those who attended exhibitions |
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Publisher: Toshiba Teli Corporation, Sales Div. |
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122H230823E |