CoaXPress 2.0 Camera EX series (CMOS, High performance)
EX670AMG-X / EX670AMCG-X
- CoaXPress 2.0
- 67 MP
- APS-C
- 1.8 type
- GS-CMOS
- B/W
- Color
- 64.5 fps
- TeliCore
- Lens mount-less
EX670AM Series is an integrated camera with a CoaXPress 2.0 interface.
Incorporating a 67MP CMOS sensor, the EX Series provides a wide field of view.
The use of CXP-12 Quad allows high speed transfer of images.
Measuring only 60 mm square, the chassis can be installed easily.
The lens-mountless structure makes it possible to use different lenses according to the application requirements.
Key Features
- e2v 67MP CMOS sensor
- TELI original IP core
- Global electronic shutter
- CoaXPress 2.0 interface
- 50Gbps transfer bandwidth provided by CXP-12 Quad
- GenICam conformity
- IIDC2 Digital Camera Control Specification
- Square grid array
- Camera control / image acquisition by TeliCamSDK
Specifications
B/W Camera
| Model | EX670AMG-X |
|---|---|
| Interface | CoaXPress 2.0 |
| Pixels | 67M |
| Imager | CMOS image sensor |
| Imager model | EV2S67MB |
| Resolution | 8,192(H) x 8,192(V) |
| Frame rate | 64.5fps (CXP-12 Quad, Mono 8bit) 31.6fps (CXP-6 Quad, Mono 8bit) 15.8fps (CXP-12, Mono 8bit) 8fps (CXP-6, Mono 8bit) |
| Pixel size | 2.5μm x 2.5μm |
| Scanning area | 20.48mm(H) x 20.48mm(V) |
| Image size | 1.8 type (APS-C) |
| Aspect ratio | 1:1 |
| Scanning | Progressive |
| Electronic shutter method | Global shutter |
| Random Trigger Shutter Type | External Trigger / Software Trigger / Link Trigger |
| Random Trigger Shutter Mode | Edge / Level / Bulk (255 times) |
| Sequential Shutter | 16 entry (max) |
| Exposure Time | MANUAL: 10μs to 16s Random Trigger Shutter: 10μs to 1s (Edge or Bulk mode), 200μs to Trigger width (Level mode) |
| Synchronization System | Internal |
| Optical glass/filter | Dust-proof glass |
| Sensitivity | 2,500 lx (F8, 1/66.7s) |
| Minimum illuminance | 1 lx (F1.4, Gain: +36dB, Video level: 50%) |
| Gain | MANUAL: 0 to +36dB |
| Black Level | -25% to +25% |
| LUT | In 12bit, Out 12bit |
| Image Output Format | Mono12, Mono10, Mono8 |
| Readout Mode | All pixel, Scalable, Binning, Mirroring, Flip |
| External trigger input | "Low: 0 to 0.5V, High: 2 to 24.0V High active / Low active, Pulse width: 200μs (minimum) |
| Power supply | PoCXP / DC+24V (18.5V to 26V) (HIROSE connector) |
| Power consumption | 13W max. |
| Lens mount | Mountless (Φ50 H7) |
| External dimension | 60(W) x 60(H) x 80(D) mm (Not including protruding parts) |
| Mass | approx. 280g |
| Operation temperature | 0°C to 40°C (below 60°C on cabinet surface) |
| Operation humidity | 10% to 90% (no condensation) |
| Conformity | CE, FCC, RoHS, WEEE, CoaXPress 2.0, GenICam, IIDC2 |
Color Camera
| Model | EX670AMCG-X |
|---|---|
| Interface | CoaXPress 2.0 |
| Pixels | 67M |
| Imager | CMOS image sensor |
| Imager model | EV2S67MC |
| Resolution | 8,192(H) x 8,192(V) |
| Frame rate | 64.5fps (CXP-12 Quad, Bayer 8bit) 31.6fps (CXP-6 Quad, Bayer 8bit) 15.8fps (CXP-12, Bayer 8bit) 8fps (CXP-6, Bayer 8bit) |
| Pixel size | 2.5μm x 2.5μm |
| Scanning area | 20.48mm(H) x 20.48mm(V) |
| Image size | 1.8 type (APS-C) |
| Aspect ratio | 1:1 |
| Scanning | Progressive |
| Electronic shutter method | Global shutter |
| Random Trigger Shutter Type | External Trigger / Software Trigger / Link Trigger |
| Random Trigger Shutter Mode | Edge / Level / Bulk (255 times) |
| Sequential Shutter | 16 entry (max) |
| Exposure Time | MANUAL: 10μs to 16s Random Trigger Shutter: 10μs to 1s (Edge or Bulk mode), 200μs to Trigger width (Level mode) |
| Synchronization System | Internal |
| On-chip Color Filter | RGB primary color mosaic-on-tip color filter |
| Optical glass/filter | Dust-proof glass |
| Sensitivity | 2,100 lx (F5.6, 1/66.7s) |
| Minimum illuminance | 2 lx (F1.4, Gain: +36dB, Video level: 50%) |
| Gain | MANUAL: 0 to +36dB |
| Black Level | -25% to +25% |
| LUT | In 12bit, Out 12bit |
| Image Output Format | (Bayer 12bit, Bayer 10bit,) Bayer 8bit |
| Image Output Format | (Bayer 12bit, Bayer 10bit,) Bayer 8bit |
| Readout Mode | All pixel, Scalable, Binning, Mirroring, Flip |
| External trigger input | "Low: 0 to 0.5V, High: 2 to 24.0V High active / Low active, Pulse width: 200μs (minimum) |
| Power supply | PoCXP / DC+24V (18.5V to 26V) (HIROSE connector) |
| Power consumption | 13.3W max. |
| Lens mount | Mountless (Φ50 H7) |
| External dimension | 60(W) x 60(H) x 80(D) mm (Not including protruding parts) |
| Mass | approx. 280g |
| Operation temperature | 0°C to 40°C (below 60°C on cabinet surface) |
| Operation humidity | 10% to 90% (no condensation) |
| Conformity | CE, FCC, RoHS, WEEE, CoaXPress 2.0, GenICam, IIDC2 |
Introduction Video
Introduction video of the demonstration at the exhibition
"ITE2020".
Other Documents
[Case study 1] Circuit board inspection using CoaXPress 67MP camera
We will introduce an example of imaging a circuit board with 67-megapixel (MP) camera "EX670AMG-X" (number of pixels: 8,192 x 8,192) and 4MP camera (number of pixels: 2,048 x 2,048).
"EX670AMG-X" is the ideal camera for inspections that require 16 times the number of pixels and high resolution of a 4MP camera.
In addition, by using VS Technology lens "VS-HX3535", high-resolution, high-definition, and high-contrast imaging can be performed.
Features of "EX670AMG-X"
- Equipped with 67MP high resolution global shutter CMOS sensor from Teledyne e2v
- Adoption of CXP-12 Quad achieves transfer bandwidth of 50 Gbps
- Mountless structure, F-mount / M42-mount conversion adapter available
- Ideal for inspections that require high-resolution, high-speed imaging
Features of "VS-HX seties" lens
- APS-C compatible high resolution fixed focus lens (F-mount / M42-mount compatible)
- Light weight and small size of about 500g or less (without lens mount)
- Significantly improved resolution from the center to the periphery compared to conventional models
- Designed to reduce distortion and flare
VS Technology Corporation : Click here for details of "VS-HX series"
* You will be transferred to an external website. (Open in a new window.)
Comparison of captured images
Compare the images of the same field of view captured by EX670AMG-X and 4MP camera.
This camera has 16 times the number of pixels compared to 4MP camera, enabling wide-field, high-definition, and high-contrast imaging.
By using this camera in combination with VS-HX series lenses, you can get the maximum shooting performance.
For this comparison, VS-HX3535 is used as the shooting lens for this camera, and the f=16mm lens is used for the 4MP camera.
In addition, the two cameras capture the same field of view, cut out the same dimensions, and enlarge it to the same size for comparison.
[ Subject image ]
* Click to enlarge
Image comparison : "EX670AMG-X" camera image vs. 4Mp camera image
* Click to enlarge
Consideration
The number of pixels of this camera and the resolving power of the lens allow for high-definition rendering of soldered parts, characters engraved on ICs, circuit patterns, and the edges of silk-printed parts.
[Case study 2] Wafer inspection using CoaXpress 67M color camera
We will introduce an example of wafer imaging with 67-megapixel (MP) color camera "EX670AMCG-X" (number of pixels: 8,192 x 8,192) and 4MP color camera (number of pixels: 2,048 x 2,048).
In this case, using VS Technology's macro lens "VS-L5018FL/F" enables optimal macro imaging even with a camera that uses a large format sensor like our EX series cameras.
Features of "EX670AMCG-X"
- Equipped with 67MP high resolution global shutter CMOS Color sensor from Teledyne e2v
- Adoption of CXP-12 Quad achieves transfer bandwidth of 50 Gbps
- Mountless structure, F-mount / M42-mount conversion adapter available
- Ideal for inspections that require high-resolution, high-speed imaging
Features of "VS-L(F) seties" lens
- 29 - 45mm sensor support
- Focal Length 18 - 200mm
- Distortionless
- Select mount adaptors are available (M42, TFL and more)
VS Technology Corporation : Click here for details of "VS-L(F) series"
* You will be transferred to an external website. (Open in a new window.)
Comparison of captured images
Using the EX670AMCG-X and a 4Mp camera, images of the chip portion of the wafer captured at the same resolution are compared.
It used the "VS-L5018FL/F" lens for the EX670AMCG-X.
* Click to enlarge
Image comparison : "EX670AMCG-X" camera image vs. 4Mp camera image
The 4Mp camera captures two chips, but the EX670AMCG-X can capture 40 chips.
[ Subject image ]
* Click to enlarge
Consideration
The EX670AMCG-X has a large imaging size of 1.8 inches and a narrow pixel size of 2.5 μm x 2.5 μm (equivalent to 5 μm as color) color camera, making lens selection more difficult than with a 4MP color camera (Imaging size 1 inch, pixel size 5.5 μm × 5.5 μm).
By using a lens that satisfies this condition, it is possible to image a wide area at once while maintaining resolution.