TOSHIBA TELI CORPORATION

CoaXPress 2.0 Camera EX series (CMOS, High performance)

EX670AMG-X / EX670AMCG-X

CoaXPress 2.0 Camera EX series (CMOS, High performance) EX670AM Series

coaxpress logo

  • CoaXPress 2.0
  • 67 MP
  • APS-C
  • 1.8 type
  • GS-CMOS
  • B/W
  • Color
  • 64.5 fps
  • TeliCore
  • Lens mount-less

EX670AM Series is an integrated camera with a CoaXPress 2.0 interface.
Incorporating a 67MP CMOS sensor, the EX Series provides a wide field of view.
The use of CXP-12 Quad allows high speed transfer of images.
Measuring only 60 mm square, the chassis can be installed easily.
The lens-mountless structure makes it possible to use different lenses according to the application requirements.

See other CoaXPress 2.0 Camera EX series

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Key Features

  • e2v 67MP CMOS sensor
  • TELI original IP core
  • Global electronic shutter
  • CoaXPress 2.0 interface
  • 50Gbps transfer bandwidth provided by CXP-12 Quad
  • GenICam conformity
  • IIDC2 Digital Camera Control Specification
  • Square grid array
  • Camera control / image acquisition by TeliCamSDK

Specifications

B/W Camera

EX670AMG-X Specifications table
Model EX670AMG-X
Interface CoaXPress 2.0
Pixels 67M
Imager CMOS image sensor
Imager model EV2S67MB
Resolution 8,192(H) x 8,192(V)
Frame rate 64.5fps (CXP-12 Quad, Mono 8bit)
31.6fps (CXP-6 Quad, Mono 8bit)
15.8fps (CXP-12, Mono 8bit)
8fps (CXP-6, Mono 8bit)
Pixel size 2.5μm x 2.5μm
Scanning area 20.48mm(H) x 20.48mm(V)
Image size 1.8 type (APS-C)
Aspect ratio 1:1
Scanning Progressive
Electronic shutter method Global shutter
Random Trigger Shutter Type External Trigger / Software Trigger / Link Trigger
Random Trigger Shutter Mode Edge / Level / Bulk (255 times)
Sequential Shutter 16 entry (max)
Exposure Time MANUAL: 10μs to 16s
Random Trigger Shutter: 10μs to 1s (Edge or Bulk mode), 200μs to Trigger width (Level mode)
Synchronization System Internal
Optical glass/filter Dust-proof glass
Sensitivity 2,500 lx
(F8, 1/66.7s)
Minimum illuminance 1 lx
(F1.4, Gain: +36dB, Video level: 50%)
Gain MANUAL: 0 to +36dB
Black Level -25% to +25%
LUT In 12bit, Out 12bit
Image Output Format Mono12, Mono10, Mono8
Readout Mode All pixel, Scalable, Binning, Mirroring, Flip
External trigger input "Low: 0 to 0.5V, High: 2 to 24.0V
High active / Low active, Pulse width: 200μs (minimum)
Power supply PoCXP / DC+24V (18.5V to 26V) (HIROSE connector)
Power consumption 13W max.
Lens mount Mountless (Φ50 H7)
External dimension 60(W) x 60(H) x 80(D) mm (Not including protruding parts)
Mass approx. 280g
Operation temperature 0°C to 40°C (below 60°C on cabinet surface)
Operation humidity 10% to 90% (no condensation)
Conformity CE, FCC, RoHS, WEEE, CoaXPress 2.0, GenICam, IIDC2

Color Camera

EX670AMCG-X Specifications table
Model EX670AMCG-X
Interface CoaXPress 2.0
Pixels 67M
Imager CMOS image sensor
Imager model EV2S67MC
Resolution 8,192(H) x 8,192(V)
Frame rate 64.5fps (CXP-12 Quad, Bayer 8bit)
31.6fps (CXP-6 Quad, Bayer 8bit)
15.8fps (CXP-12, Bayer 8bit)
8fps (CXP-6, Bayer 8bit)
Pixel size 2.5μm x 2.5μm
Scanning area 20.48mm(H) x 20.48mm(V)
Image size 1.8 type (APS-C)
Aspect ratio 1:1
Scanning Progressive
Electronic shutter method Global shutter
Random Trigger Shutter Type External Trigger / Software Trigger / Link Trigger
Random Trigger Shutter Mode Edge / Level / Bulk (255 times)
Sequential Shutter 16 entry (max)
Exposure Time MANUAL: 10μs to 16s
Random Trigger Shutter: 10μs to 1s (Edge or Bulk mode), 200μs to Trigger width (Level mode)
Synchronization System Internal
On-chip Color Filter RGB primary color mosaic-on-tip color filter
Optical glass/filter Dust-proof glass
Sensitivity 2,100 lx
(F5.6, 1/66.7s)
Minimum illuminance 2 lx
(F1.4, Gain: +36dB, Video level: 50%)
Gain MANUAL: 0 to +36dB
Black Level -25% to +25%
LUT In 12bit, Out 12bit
Image Output Format (Bayer 12bit, Bayer 10bit,) Bayer 8bit
Image Output Format (Bayer 12bit, Bayer 10bit,) Bayer 8bit
Readout Mode All pixel, Scalable, Binning, Mirroring, Flip
External trigger input "Low: 0 to 0.5V, High: 2 to 24.0V
High active / Low active, Pulse width: 200μs (minimum)
Power supply PoCXP / DC+24V (18.5V to 26V) (HIROSE connector)
Power consumption 13.3W max.
Lens mount Mountless (Φ50 H7)
External dimension 60(W) x 60(H) x 80(D) mm (Not including protruding parts)
Mass approx. 280g
Operation temperature 0°C to 40°C (below 60°C on cabinet surface)
Operation humidity 10% to 90% (no condensation)
Conformity CE, FCC, RoHS, WEEE, CoaXPress 2.0, GenICam, IIDC2

Introduction Video


Introduction video of the demonstration at the exhibition "ITE2020" .

Other Documents

[Case study 1] Circuit board inspection using CoaXPress 67MP camera

We will introduce an example of imaging a circuit board with 67-megapixel (MP) camera "EX670AMG-X" (number of pixels: 8,192 x 8,192) and 4MP camera (number of pixels: 2,048 x 2,048).
"EX670AMG-X" is the ideal camera for inspections that require 16 times the number of pixels and high resolution of a 4MP camera.
In addition, by using VS Technology lens "VS-HX3535", high-resolution, high-definition, and high-contrast imaging can be performed.

Circuit board inspection image using CoaXPress 67M camera

Features of "EX670AMG-X"

  • Equipped with 67MP high resolution global shutter CMOS sensor from Teledyne e2v
  • Adoption of CXP-12 Quad achieves transfer bandwidth of 50 Gbps
  • Mountless structure, F-mount / M42-mount conversion adapter available
  • Ideal for inspections that require high-resolution, high-speed imaging

Features of "VS-HX seties" lens

  • APS-C compatible high resolution fixed focus lens (F-mount / M42-mount compatible)
  • Light weight and small size of about 500g or less (without lens mount)
  • Significantly improved resolution from the center to the periphery compared to conventional models
  • Designed to reduce distortion and flare

VS Technology Corporation : Click here for details of "VS-HX series"
* You will be transferred to an external website. (Open in a new window.)

Comparison of captured images

Compare the images of the same field of view captured by EX670AMG-X and 4MP camera.
This camera has 16 times the number of pixels compared to 4MP camera, enabling wide-field, high-definition, and high-contrast imaging.
By using this camera in combination with VS-HX series lenses, you can get the maximum shooting performance.
For this comparison, VS-HX3535 is used as the shooting lens for this camera, and the f=16mm lens is used for the 4MP camera.
In addition, the two cameras capture the same field of view, cut out the same dimensions, and enlarge it to the same size for comparison.

[ Subject image ]

Subject image
Subject image (taken within the red frame in the center of the photo)
* Click to enlarge

Image comparison : "EX670AMG-X" camera image vs. 4Mp camera image

comparison image
comparison image
* Click to enlarge

Consideration

The number of pixels of this camera and the resolving power of the lens allow for high-definition rendering of soldered parts, characters engraved on ICs, circuit patterns, and the edges of silk-printed parts.

[Case study 2] Wafer inspection using CoaXpress 67M color camera

We will introduce an example of wafer imaging with 67-megapixel (MP) color camera "EX670AMCG-X" (number of pixels: 8,192 x 8,192) and 4MP color camera (number of pixels: 2,048 x 2,048).
In this case, using VS Technology's macro lens "VS-L5018FL/F" enables optimal macro imaging even with a camera that uses a large format sensor like our EX series cameras.

Wafer inspection using CoaXpress 67M color camera

Features of "EX670AMCG-X"

  • Equipped with 67MP high resolution global shutter CMOS Color sensor from Teledyne e2v
  • Adoption of CXP-12 Quad achieves transfer bandwidth of 50 Gbps
  • Mountless structure, F-mount / M42-mount conversion adapter available
  • Ideal for inspections that require high-resolution, high-speed imaging

Features of "VS-L(F) seties" lens

  • 29 - 45mm sensor support
  • Focal Length 18 - 200mm
  • Distortionless
  • Select mount adaptors are available (M42, TFL and more)

VS Technology Corporation : Click here for details of "VS-L(F) series"
* You will be transferred to an external website. (Open in a new window.)

Comparison of captured images

Using the EX670AMCG-X and a 4Mp camera, images of the chip portion of the wafer captured at the same resolution are compared.
It used the "VS-L5018FL/F" lens for the EX670AMCG-X.

Subject image
Subject image (taken within the red frame in the center of the photo)
* Click to enlarge

Image comparison : "EX670AMCG-X" camera image vs. 4Mp camera image

The 4Mp camera captures two chips, but the EX670AMCG-X can capture 40 chips.

[ Subject image ]

comparison image
comparison image
* Click to enlarge

Consideration

The EX670AMCG-X has a large imaging size of 1.8 inches and a narrow pixel size of 2.5 μm x 2.5 μm (equivalent to 5 μm as color) color camera, making lens selection more difficult than with a 4MP color camera (Imaging size 1 inch, pixel size 5.5 μm × 5.5 μm).
By using a lens that satisfies this condition, it is possible to image a wide area at once while maintaining resolution.