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Notification of collaboration with TriEye
Toshiba Teli and TriEye have started collaboration on commercialization of a CMOS-based Short-Wave Infrared (Hereinafter ‘’SWIR’) camera.
Conventionally, highly productive CMOS-based image sensor could not apply a SWIR sensing application due to silicon transmittance of SWIR.
As a SWIR sensing application requires an InGaAs-based image sensor, which has low production yield and high cost, the application has been limited to semiconductor fabrication, aerospace and so on.
TriEye has developed the first CMOS-based SWIR mass production, Raven image sensor with their unique proprietary technology. A high production yield of their CMOS-based image sensor provides an unparalleled low-cost SWIR solution.
The collaboration between Toshiba Teli’s capability of mass-production technology and TriEye’s CMOS-based SWIR image sensor technology expands usage of SWIR sensing applications for a wide variety of markets.
The first prototyped camera, resulting from the collaboration between Toshiba Teli and TriEye will be shown at the Industrial Camera EXPO (20-22 April 2022, Japan).
There you can have a look at their SWIR sensing solution first hand.
About TriEye
TriEye is the pioneer of mass-market, CMOS-based Short-Wave infrared (SWIR) sensing solutions. Based on advanced academic research, TriEye’s breakthrough and proprietary technology enables cost-effective, high-resolution image data and depth perception in all weather and lighting conditions. Founded in 2017, the company’s cutting-edge technology allows perception systems to operate and deliver reliable image data and actionable information, while reducing expenditure by up to 1,000x the existing industry rates. In the past the company has announced collaborations with Porsche, Hitachi Astemo, Continental Engineering, Trimble and DENSO. For more information, visit https://trieye.tech/