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E-Newsletter "teli TIME" Vol.106
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June, 2023 [ Vol.106 ] |
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Dear Sirs and Madams, Features of software development kit of "TeliCamSDK" (Windows version) for our machine vision camera are renewed ! The new version supports our USB3, GigE and CoaXPress cameras. |
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Case Study |
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Board inspection with CoaXPress 67M camera ! | ||
Here is an example of a circuit board imaged with the 67.11 megapixel camera "EX670AMG-X" (8,192 x 8,192 pixels) and 4.19 megapixel camera (2,048 x 2,048 pixels). The EX670AMG-X is the ideal camera for inspections that require 16 times the number of pixels and high resolution of a 4.19 megapixel camera. In addition, by using the VS Technology lens "VS-HX3535", high-resolution, high-definition, and high-contrast imaging can be performed. |
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New Catalog Information |
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Machine Vision Camera Catalog All Models 2023 - 2024 | ||
[ Main publication models ] - CoaXPress 2.0 camera EX series - Dual USB3 camera DDU series - USB3 camera DU / BU series - GigE camera BG series - Camera Link camera BC / CSC series |
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Thanks for reading, and we are looking forward to seeing you soon ! | ||
This e-mail newsletter is delivered to those who attended exhibitions |
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Publisher: Toshiba Teli Corporation, Sales Div. |
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122H230621E |