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Thank you and report of "Sensor & Imaging EXPO 2023 of OPIE’23"
Toshiba Teli Corporation participated in the Sensor & Imaging EXPO 2023 of OPIE’23 held at PACIFICO Yokohama from April 19th (Wed) to 21st (Fri) to showcase diverse inspection solutions.
We would like to express our sincere gratitude for all the people who visited our booth.
[ Introductory video of exhibits (Japanese version)]
Descriptions of our booth
Our booth consisted of the following ten sections, each of which is described below;
Descriptions of each section
1. Surface Flaw Detection Scope TM
We showcased an optical solution capable of performing a scratch inspection with a single shot.
A special optical system can display scratches on the surface of plastics in color without post-processing using a PC.
[ Cameras and software used ]
- BU2409MCF
https://www.toshiba-teli.co.jp/en/products/industrial-camera/usb-camera-bu2409m.htm - TeliViewer
https://www.toshiba-teli.co.jp/en/products/industrial-camera/software-telicamsdk.htm
[ Download a document containing exhibition panel image ]
2. CMOS based SWIR camera (Reference exhibit)
We demonstrated a prototype camera equipped with a TriEye CMOS sensor that enables short-wavelength infrared (SWIR) imaging based on CMOS.
[ Related article ]
- CMOS based SWIR camera (Topics : Notification of collaboration with TriEye)
https://www.toshiba-teli.co.jp/en/topics/news/2204001.htm
[ Download a document containing exhibition panel image ]
* Company name, logo or other names are trademark or registered trademark of related companies in some cases
Information including specifications, content of services and contact information, is current on the date of the press announcement, but is subject to change without prior notice.