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The report of "International Technical Exhibition on Image Technology and Equipment 2024"

TOSHIBA TELI Booth at ITE2024
TOSHIBA TELI Booth at ITE2024

Toshiba Teli Corporation participated in the International Technical Exhibition on Image Technology and Equipment (ITE) 2024 held at PACIFICO Yokohama from December 4th (Wed) to December 6th (Fri).
We showcased various products such as high-resolution visible cameras (CoaXPress 2.0, DDU USB3, USB3), SWIR camera, and new imaging solution.

We would like to express our sincere gratitude for all the people who visited our booth.

Our engineer gave the lecture at the International Imaging Seminar held on December 7th (Thu).
The report is published at the bottom of this page.

Descriptions of our booth

Our booth consisted of the following ten sections, each of which is described below;

  1. New platform camera "F Series" (Reference Exhibit)
  2. 2.7 Series / Latest 2.2 Series Pregius S equipped camera (New)
  3. Surface Flaw Detection Scope : SFD240305A (New)
  4. Silicon based SWIR camera (Under development)
  5. CoaXPress 2.0 Camera : EX670AMCG-X
  6. Camera lineup of aspect ratio 1:1
  7. Dual USB3 Camera : DDU2607MCF (New)
  8. Machine Vision Cameras Lineup

Seminar

Please see here for a report on the International Imaging Seminar lectures.

Introducing the exhibition corner

1. New platform camera "F Series" (Reference Exhibit)

Following the existing platform based on our core industrial camera series, the "B Series," we are currently developing a new platform camera, the "F Series".
At this exhibition, we provided detailed information during the seminar and shared early insights through materials and mock-ups at the display corner.

For example, as a successor to the current "BU Series" (USB 5Gbps, 29mm model) cameras, we are developing USB 5Gbps and USB 10Gbps models for the F Series.

The releases are planned for October 2025 for the USB 10Gbps models and December 2025 for the USB 5Gbps models.

New platform camera F Series corner

[ New platform camera "F Series" video (in Japanese) ]

* Japanese only

2. 2.7 Series / Latest 2.2 Series Pregius S equipped camera (New)

Toshiba Teli exhibited BU300MG (3.1MP mono camera) equipped with Sony's new CMOS sensor "IMX900," and BU1208MCF (12.3M pixel color model) equipped with Sony’s CMOS sensor 2.7 series.

"BU300MG" demonstration showed the sensor's unique function "Quad HDR", which allows you to generate HDR images by changing the exposure time setting for each pixel.

"BU1208MCF" demonstration showed the excellent color reproduction of 2.7 series by shooting colorful subjects.

Cameras equipped with the 4th generation “Pregius S” corner

[ Cameras and software used ]

[ Download a document containing exhibition panel image ]

3. Surface Flaw Detection Scope : SFD240305A (New)

Toshiba Teli's surface flaw detection scope and the lens visual inspection device produced by Tokai Optical can inspect the minute scratches on the specific surfaces.
Surface flaw detection scope takes images through the special optical system (the special filter) developed by Toshiba Research & Development Center, which allows it to display scratches on a glossy flat surface without post-processing on a PC.

Surface flaw detection scope was exhibited at VISION 2024 held in Stuttgart, Germany in October 2024, and won the "VISION Award 2024."

The lens visual inspection device is equipped with Teli's surface flaw detection scope, developed by Tokai Optical. The demonstration showed the inspection of minutes scratched on the curved lens surfaces.

Surface Flaw Detection Scope

[ Surface Flaw Detection Scope SFD240305A video (in Japanese) ]

* Japanese only

[ System, installed camera and software used ]

[ Download a document containing exhibition panel image ]

4. Silicon based SWIR camera (Under development)

TriEye's SWIR CMOS cameras were demonstrated to shoot two types of subjects.

The demonstration for strawberry showed the surface of a crushed strawberry was colored as black.

The demonstration for wafer showed that SWIR CMOS camera can see through with SWIR light sources.

Silicon based SWIR camera

[ Reference ]

[ Download a document containing exhibition panel and signage image ]

5. CoaXPress 2.0 Camera : EX670AMCG-X

We exhibited the demonstration to enlarge wiring pattern on wafer by 67 MP CMOS Camera "EX670AMCG-X" equipped with the latest CoaXPress 2.0 CXP-12 Quad.
The demonstration shows high-resolution image on 4K monitor.

CoaXPress 2.0 camera corner

[ CoaXPress 2.0 Camera EX series video (in Japanese) ]

* Japanese only

[ Cameras and software used ]

[ Product leaflet ]

[ Download a document containing exhibition panel and signage image ]

6. Camera lineup of aspect ratio 1:1

We introduced a line-up of cameras with sensor aspect ratio 1:1. The sensor aspect ratio of EX370BMG-X is also 1:1.
The camera with sensor aspect ratio includes the following models in our line-up.

Camera lineup of aspect ratio 1:1 corner

[ Applicable cameras ]

[ Download a document containing exhibition panel image ]

7. Dual USB3 Camera : DDU2607M series (New)

Our original Dual USB3 camera equipped with two channels of USB 5Gbps (USB3.1 Gen1) interface is also exhibited.
The demonstration showed two Dual USB camera shoot simultaneously with single connection and dual connection, and the dual connection camera can shoot at twice the frame rate of a single connection camera.

Dual USB3 Camera corner

[ DDU2607M series introduction video (from ITE 2023 in Japanese) ]

* Japanese only

[ Cameras and software used ]

[ Download a document containing exhibition panel image ]

8. Machine Vision Cameras Lineup

We exhibited a panel showing the lineup of our major industrial cameras by interface and put them on display.

Industrial cameras lineup

[ Camera series listings ]


Industrial cameras lineup
Machine vision cameras lineup

Click here for larger image

International Imaging Seminar 2024

At the International Imaging Seminar held simultaneously with the ITE, Teli’s engineer presented a seminar.

Lecture at the seminar

[ Seminar lecture video ]

* Japanese only

[ Seminar material ]

Thank you for taking time in your busy schedule to attend the seminar.


* Pregius, Pregius logo, Pregius S, Pregius S logo are trademarks of Sony Corporation.

* CoaXPress and CoaXPress logo are trademarks of JIIA (Japan Industrial Imaging Association).

* USB3 Vision and logo, GigE Vision and logo are trademarks or registered trademarks of A3 (Association for Advancing Automation).

* Company name, logo or other names are trademarks or registered trademarks of related companies in some cases

Information including specifications, content of services and contact information, is current on the date of the press announcement, but is subject to change without prior notice.

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